pcb Lead-Free Hot Air Reflow Oven

It melt solder paste by heating to make the mounted components and PCB welding plate together through the solder paste alloy.

V-MC535 pcb Lead-Free Hot Air Reflow Oven

Feature:

1.Industrrial PC control embodies the good stability and compatibility, reliability, and improve anti-jamming of the system.

2.The temperature system is a full range of dynamic constant temperature storage plate,reduce temperature difference effect of the temperature zone,adoption of double-sided temperature technology can reduce and prevent PCB plate bending deformation phenomenon.

3.automatic detection function can automatically detect chain operation,and high low temperature alarm function.

4.The system adopts superior N2 flowmeter,it can ensure accuracy of N2 concentration control through the data acquisition and control card.

5.System has a computer analysis database,can store customers information with different temperature curve.

Specifications:

Heating zone	Top5/Bottom5
Cooling zone	Top1/Bottom1
Mesh width	350mm/Mesh type 350mm
Height of conveyor	Mesh880± 20mm; Chain900± 20mm
Transport system	Chain and mesh or mesh
Conveyor speed	200-1800mm/min
Warm-up time	About 20 minutes
Temperature control	PID&SSR, room temperature-320degree centigrade
Temperature distribution deviation	Plus/minus 3degree centigrade
Exhaust Volume	8stere/min 2Exhausts diameter 120mm

Products of the machine:

Service:

1.Customization is available.

2.Free master operator training program. 

3.Reasonable and  negotiable  price,short lead time.

pcb Lead-Free Hot Air Reflow Oven